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Reflow tin plating is an electrodeposit process that has
exceptional solderability compared to conventional electroplated
tin. This exceptional behaviour is attributed to a pure, dense,
porosity-free structure that exhibits slower copper-tin intermetallic
compound growth and reduced surface oxidation. Additional
benefits of a reflowed tin metallization include uniform tin
distribution, lead free deposit, no tin whiskers, improved
insertion force and excellent formability during stamping.
Capabilities:
Process - Continuous
Coil
Preplates - Copper
and Nickel
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